Ceramic Bond Transitional Pad designed for light grinding and polishing stone and concrete. 

• Diameter:3"
• Bonding: Ceramic
• Equipment: Floor grinding machines with Velcro attachment
• Grit Size: #30 #50 #100 #200 #400
• Grinding Method: Use wet or dry

Ceramic bond grinding pads with Velcro backing for polishing concrete and smoothing scratch patterns. 

Ceramic bonding strength is between metal bonding and resin bonding. Using  ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.